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Name: | Thermally Conductive Adhesive Tape | Tape Type: | Filled Acrylic Polymer |
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Filler Type: | Ceramic | Thickness: | 0.125mm/0.25mm/0.38mm/0.50mm |
Thermal Conductivity: | 0.60 W/m-K | Peel Adhesion Strength: | 990~1700gf/inch |
Highlight: | thermal adhesive tape,heat transfer adhesive tape |
5mils/10mils/15mils/20mils White Thermally Conductive Adhesive Tape for Heat Sinks
Product Description
Thermally Conductive Adhesive Transfer Tapes are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).
Product Detail
Item | Non- carrier base Thermal conductive tape | |||||||||||||||
BP-05N | BP-10N | BP-15N | BP-20N | BP-25N | BP-30N | BP-40N | BP-50N | |||||||||
Tape 1 | AHS-CT | AHS-CT | AHS-CT | AHS-CT | AHS-CT | AHS-CT | AHS-CT | AHS-CT | ||||||||
Carrier | / | / | / | / | / | / | / | / | ||||||||
White Liner | 0.125mm | |||||||||||||||
Length | 50M | 50M | 50M | | |
50M |
50M |
50M | ||||||||
Width | 1050mm | |||||||||||||||
Adhesion Thickness | 0.05mm | 0.1mm | 0.15mm | 0.2mm | 0.25mm | 0.3mm | 0.4mm | 0.5mm | ||||||||
Total Thickness | 0.05mm | 0.1mm | 0.15mm | 0.2mm±10% | 0.25mm±10% | 0.3mm | 0.4mm±10% | 0.5mm±10% | ||||||||
180°Peel Adhesion | >11.76 | >11.76 | >13.68 | >14.70 | >17.64 | >17.64 | >17.64 | >17.64 | ||||||||
Temperature Resistance | | | | | | | | | ||||||||
Holding power | | | | | | | | | ||||||||
Insulating Strength | 3.0KV, | 3.0KV, | 4.0KV, | 4.0KV, | 4.0KV, | 4.0KV, | 4.0KV, | 4.0KV, | ||||||||
Thermal(W/mk) | >0.6 | >0.6 | >0.8 | >0.8 | >0.8 | >0.8 | >0.8 | >0.8 | ||||||||
Service Temperature | -20℃~+120℃ |
Features
High mechanical strength
Improved surface wet-out for rough surface/LSE substrates
Excellent shock performance
Wider and longer roll is available
Halogen free
Ideal for thin bonding applications
Good thermal transfer
Application
1. IC Packaging Heat Conduction
2. Heatsink-Thermal Interface Attachment
3. Battery Thermal Management
4. LED Lighting Thermal Management
5. Heatsink-Thermal Interface-Non Bonding
6. Flex Bonding
7. Thermal Interface-Damping-Cushioning
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